Help with an eagle part design please

[Steve001]

Hi All

Anyone good with eagle ? need help i am trying to make a texas inst OPA569

http://www.ti.com/lit/ds/symlink/opa569.pdf

Struggling making the thermal pad design with the exposed pad and the via's to the pad on the bottom layer and how do i make the connections to multiple pins as various functions are across two pins of the ic ?

Steve

[kersing]

Have you considered trying cadsoft community resources?

[EtsDriver]

To get multiple pins into one function, you can just use ctrl to select them all from the pad desing in the device creation, and then you click the connect button. they all will be grouped under one name, and the schematic symbol then needs only one pin for all the same pins... I have never gotten an way to have thermal pads to have via in my desings, but i think usual VIA could be fine...

Made a little dummy demostration:
used smd pads to make the "component", here its blown up to demostrate all the parts used to create powerpads...

1.JPG (45.26 KiB) Viewed 5831 times

And the connections:

select powerpads_to_pin.JPG (51.4 KiB) Viewed 5831 times

multipins_one_place.JPG (47.37 KiB) Viewed 5831 times

[Steve001]

Just an update

I Have since found out that what i am trying to do with my package design is not possible in eagle

I was wanting to make the pcb foot print complete with the copper heat pads and vias so when you pick the part it's all done for you rather than doing it manually afterwards

another issue was when you have multiple pins for input and out puts and you have big track widths to accommodate the current sometimes you get overlaps on the pads.
I wanted one common pin for the two that would sit in the centre so this was minimised.

The way round this is to group the pads and use polygon function.

bit disappointed but i have a work around

Steve